NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS) : FUND RAISING PRIVATE PLACEMENT OF UP TO 70,820,000 NEW ORDINARY SHARES IN THE COMPANY, REPRESENTING UP TO 10% OF THE TOTAL ISSUED SHARE CAPITAL OF THE COMPANY ("PRIVATE PLACEMENT")

NESTCON BERHAD

Type Announcement
Subject NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS)
FUND RAISING
Description 
PRIVATE PLACEMENT OF UP TO 70,820,000 NEW ORDINARY SHARES IN THE COMPANY, REPRESENTING UP TO 10% OF THE TOTAL ISSUED SHARE CAPITAL OF THE COMPANY ("PRIVATE PLACEMENT")
 
Unless otherwise stated, abbreviations used herein shall be the same as those stated in the Company’s announcements dated 12 July 2024, 17 July 2024, 31 July 2024, 23 August 2024, 30 August 2024, 13 January 2025, 6 February 2025, 14 July 2025, 29 July 2025, 18 August 2025, and 27 August 2025 (collectively referred to as the “Announcements”).

On behalf of the Board, M&A Securities is pleased to announce that the Company has on 20 January 2026 fixed the issue price of the third tranche of Placement Shares at RM0.280 per Placement Share to be issued pursuant to the Private Placement (“Price-Fixing Date”).

The aforementioned issue price of RM0.280 per Placement Share represents a discount of approximately RM0.0219 or 7.3% from the 5D-VWAMP of Nestcon Shares from 13 January 2026 to 19 January 2026, being the market day immediately preceding to the Price-Fixing Date of approximately RM0.3019 per Nestcon Share.

This announcement is dated 20 January 2026.



Announcement Info

Company Name NESTCON BERHAD
Stock Name NESTCON
Date Announced 20 Jan 2026
Category General Announcement for PLC
Reference Number GA1-20012026-00078