NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS) : FUND RAISING PRIVATE PLACEMENT OF UP TO 70,820,000 NEW ORDINARY SHARES IN THE COMPANY, REPRESENTING UP TO 10% OF THE TOTAL ISSUED SHARE CAPITAL OF THE COMPANY ("PRIVATE PLACEMENT")

NESTCON BERHAD

Type Announcement
Subject NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS)
FUND RAISING
Description 
PRIVATE PLACEMENT OF UP TO 70,820,000 NEW ORDINARY SHARES IN THE COMPANY, REPRESENTING UP TO 10% OF THE TOTAL ISSUED SHARE CAPITAL OF THE COMPANY ("PRIVATE PLACEMENT")
 
Unless otherwise stated, abbreviations used herein shall be the same as those stated in the Company’s announcements dated 12 July 2024, 17 July 2024, 31 July 2024, 23 August 2024, 30 August 2024, 13 January 2025, 5 February 2025, 14 July 2025 and 29 July 2025. (collectively referred to as the “Announcements”).

On behalf of the Board, M&A Securities is pleased to announce that the Company has on 18 August 2025 fixed the issue price of the second tranche of Placement Shares at RM0.290 per Placement Share to be issued pursuant to the Private Placement (“Price-Fixing Date”).

The aforementioned issue price of RM0.290 per Placement Share represents a discount of approximately RM0.0278 or 8.7% from the 5D-VWAMP of Nestcon Shares from 11 August 2025 to 15 August 2025, being the market day immediately preceding to the Price-Fixing Date of approximately RM0.3178 per Nestcon Share.

This announcement is dated 18 August 2025.



Announcement Info

Company Name NESTCON BERHAD
Stock Name NESTCON
Date Announced 18 Aug 2025
Category General Announcement for PLC
Reference Number GA1-18082025-00014