NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS) : FUND RAISING NESTCON BERHAD ("NESTCON" OR THE "COMPANY") PRIVATE PLACEMENT OF UP TO 10% OF THE ISSUED SHARES IN NESTCON

NESTCON BERHAD

Type Announcement
Subject NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS)
FUND RAISING
Description 
NESTCON BERHAD ("NESTCON" OR THE "COMPANY") 

PRIVATE PLACEMENT OF UP TO 10% OF THE ISSUED SHARES IN NESTCON

Unless otherwise defined, the definitions set out in the announcement dated 13 July 2022 (“Announcement”) shall apply herein.

On behalf of the Board, M&A Securities is pleased to announce that the Company has on 20 March 2023 fixed the issue price of the third tranche of Placement Shares at RM0.36 per Placement Share to be issued pursuant to the Private Placement (“Price-Fixing Date”).

The aforementioned issue price of RM0.36 per Placement Share represents a discount of approximately RM0.0374 or 9.4% from the 5D-VWAMP of Nestcon Shares from 13 March 2023 to 17 March 2023, being the market day immediately preceding to the Price-Fixing Date of approximately RM0.3974 per Nestcon Share.

This announcement is dated 20 March 2023.



Announcement Info

Company Name NESTCON BERHAD
Stock Name NESTCON
Date Announced 20 Mar 2023
Category General Announcement for PLC
Reference Number GA1-20032023-00058