Reference is made to the Company's announcements dated 1^st March 2023, 27^th March 2023, 10^th May 2023, 25^th May 2023, 9^th August 2023, 9^th November 2023, 15^th December 2023, 10^th January 2024, 20^th March 2024, 18^th April 2024, 24^th May 2024, 11^th June 2024, 11^th July 2024, 12^th August 2024, 11^th September 2024, 19^th September 2024, 18^th February 2025  and 21^st March 2025 respectively on the above matter.

The Board of Directors of HeiTech Padu Berhad ("Company") wishes to announce that in relation to the legal proceedings between Pertubuhan Keselamatan Sosial (Perkeso) and the Company vide Kuala Lumpur High Court Civil Suit No. WA-22NCvC-72-02/2023, the parties have reached an amicable settlement strictly without any admission of liability, through a Consent Judgment.

Pursuant to the Consent Judgment, a total sum of RM7,000,000.00 is to be paid by way of 28 instalments commencing from 28^th May 2026. For avoidance of doubt, the Company has yet to be served with the sealed Consent Judgment.

In this regard, the remaining trial dates fixed on 21^st May 2026 and 9^th June 2026 have been vacated.

The Company does not expect the settlement to have any material adverse effect on the financial position or operations of the Company.

This announcement is dated 13^th April 2026.