NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS) : FUND RAISING HEITECH PADU BERHAD ("HEITECH" OR THE "COMPANY") PRIVATE PLACEMENT

HEITECH PADU BERHAD

Type Announcement
Subject NEW ISSUE OF SECURITIES (CHAPTER 6 OF LISTING REQUIREMENTS)
FUND RAISING
Description
HEITECH PADU BERHAD ("HEITECH" OR THE "COMPANY")

PRIVATE PLACEMENT

Reference is made to the Company’s announcements dated 9 May 2025, 13 May 2025, 9 June 2025, 25 June 2025, 10 July 2025, 11 July 2025, 26 August 2025, 3 September 2025, 8 September 2025, 19 September 2025, 22 September 2025 and 26 September 2025 as well as the circular to shareholders dated 10 June 2025 in relation to, among others, the Private Placement ("Circular"). Unless otherwise defined, capitalised terms used in this announcement shall have the same meanings as defined in the Circular.

On behalf of the Board, RHB Investment Bank wishes to announce that the Company has submitted an application to Bursa Securities today for an extension of time of 3 months until 6 March 2026 to complete the implementation of the Private Placement.

This announcement is dated 21 November 2025.






Announcement Info

Company Name HEITECH PADU BERHAD
Stock Name HTPADU
Date Announced 21 Nov 2025
Category General Announcement for PLC
Reference Number GA1-20112025-00105