Additional Listing Announcement /Subdivision of Shares
HEITECH PADU BERHAD
1. Details of Corporate Proposal
Involve issuance of new type/class of securities ?
No
Types of corporate proposal
Private Placement
Details of corporate proposal
Private placement of up to 27,836,955 new ordinary shares in HeiTech Padu Berhad, representing up to approximately 20% of the total number of issued shares of HeiTech Padu Berhad
No. of shares issued under this corporate proposal
161,300
Issue price per share
Malaysian Ringgit (MYR) 1.5500
Par Value (if applicable)
Latest issued share capital after the above corporate proposal in the following
Units
156,645,705
Issued Share Capital
Malaysian Ringgit (MYR) 163,717,041.400
Listing Date
22 Sep 2025
Announcement Info
Company Name
HEITECH PADU BERHAD
Stock Name
HTPADU
Date Announced
19 Sep 2025
Category
Additional Listing Announcement /Subdivision of Shares
Reference Number
ALA-18092025-00016