MULTIPLE PROPOSALS HEITECH PADU BERHAD ("HEITECH" OR THE "COMPANY") (I) DIVERSIFICATION (II) BONUS ISSUE; AND (III) PRIVATE PLACEMENT (COLLECTIVELY, THE "CORPORATE EXERCISES")

HEITECH PADU BERHAD

Type Announcement
Subject MULTIPLE PROPOSALS
Description 
HEITECH PADU BERHAD ("HEITECH" OR THE "COMPANY")

(I)	DIVERSIFICATION
(II)	BONUS ISSUE; AND
(III)	PRIVATE PLACEMENT

(COLLECTIVELY, THE "CORPORATE EXERCISES")

Reference is made to the Company’s announcements dated 9 May 2025, 13 May 2025, 9 June 2025 and 25 June 2025 as well as the circular to shareholders dated 10 June 2025 in relation to the Corporate Exercises ("Circular"). Unless otherwise defined, capitalised terms used in this announcement shall have the same meanings as defined in the Circular.

On behalf of the Board, RHB Investment Bank wishes to announce that 27,836,585 Bonus Shares (including 25 treasury shares) will be issued pursuant to the Bonus Issue and will be listed and quoted on the Main Market of Bursa Securities with effect from 9.00 a.m. on 11 July 2025, being the next market day immediately after the Entitlement Date on 10 July 2025.

Following the above, the enlarged issued share capital of the Company will be RM136,652,026.40 comprising 139,184,405 Shares (including 125 treasury shares).

This announcement is dated 10 July 2025.



Announcement Info

Company Name HEITECH PADU BERHAD
Stock Name HTPADU
Date Announced 10 Jul 2025
Category General Announcement for PLC
Reference Number GA1-10072025-00054