MULTIPLE PROPOSALS HEITECH PADU BERHAD ("HEITECH" OR THE "COMPANY") (I) PROPOSED DIVERSIFICATION (II) PROPOSED BONUS ISSUE; AND (III) PROPOSED PRIVATE PLACEMENT (COLLECTIVELY, THE "PROPOSALS")

HEITECH PADU BERHAD

Type Announcement
Subject MULTIPLE PROPOSALS
Description 
HEITECH PADU BERHAD ("HEITECH" OR THE "COMPANY")

(I)	PROPOSED DIVERSIFICATION
(II)	PROPOSED BONUS ISSUE; AND
(III)	PROPOSED PRIVATE PLACEMENT

(COLLECTIVELY, THE "PROPOSALS")

Reference is made to the Company’s announcement dated 9 May 2025 in relation to the Proposals (“Announcement”). Unless otherwise defined, capitalised terms used in this announcement shall have the same meanings as defined in the aforesaid Announcement.

On behalf of the Board, RHB Investment Bank wishes to announce that the listing application to Bursa Securities in respect of the listing of and quotation for 27,836,955 Bonus Shares and up to 27,836,955 Placement Shares on the Main Market of Bursa Securities has been submitted today.

This announcement is dated 13 May 2025.



Announcement Info

Company Name HEITECH PADU BERHAD
Stock Name HTPADU
Date Announced 13 May 2025
Category General Announcement for PLC
Reference Number GA1-13052025-00016