MEMORANDUM OF UNDERSTANDING HEITECH PADU BERHAD (“HEITECH” OR “THE COMPANY”) MEMORANDUM OF UNDERSTANDING BETWEEN THE COMPANY, HUAWEI TECHNOLOGIES (MALAYSIA) SDN BHD AND MY E.G. SERVICES BERHAD

HEITECH PADU BERHAD

Type Announcement
Subject MEMORANDUM OF UNDERSTANDING
Description
HEITECH PADU BERHAD (“HEITECH” OR “THE COMPANY”)

MEMORANDUM OF UNDERSTANDING BETWEEN THE COMPANY, HUAWEI TECHNOLOGIES (MALAYSIA) SDN BHD AND MY E.G. SERVICES BERHAD

The Board of Directors of HeiTech (“Board”) wishes to announce that the Company had on 10th April 2025 entered into a Memorandum of Understanding (“MOU”) with Huawei Technologies (Malaysia) Sdn Bhd [Registration No. 200101010193 (545949-D)] (“Huawei”) and MY E.G. Services Berhad [Registration No. 200001003034 (505639-K)] (“MyEG”) in relation to working together for the purposes of Cloud and AI enabled smart government services cooperation.

Please refer to the attachment for further details.

This announcement is dated 10 April 2025.






Announcement Info

Company Name HEITECH PADU BERHAD
Stock Name HTPADU
Date Announced 10 Apr 2025
Category General Announcement for PLC
Reference Number GA1-10042025-00066


Please refer attachment below.

  1. Announcement MOU (Huawei_MyEG)_Final.pdf