Datasonic Group Berhad Annual Report 2023

30 DATASONIC GROUP BERHAD OUR LEADERSHIP 02 DATE OF APPOINTED : 1 November 2011 LENGTH OF SERVICE : 12 years Encik Hashim bin Abu holds a Bachelor of Science in Electronics Engineering from Saitama University, Japan. He was a member of Asia Pacific Technical Ladder Community since 1995. He has involved in many R&D for electronics industry including few world first microelectronics solutions. He brings with him more than 32 years of experience in the industry from multinational company, government agency and government link company. Prior joining Datasonic, he was a senior management member of Mimos Berhad before seconded to its subsidiary, Malaysia Microelectronics Solutions Sdn. Bhd. as Operations Director. He has involved in few government projects including as technical committee member for MyKad implementation (2002-2008), technical evaluation committee member for MM Chip project under MiGHTS Jabatan Perdana Menteri (2004-2006), technical committee member for Standard Malaysia ISO TC-9 (20042010). He was also a JEDEC (Joint Electronics Device Engineering Council) Technical Committee member from 1995 to 2010. In Datasonic, he led the engineering team as Project Director for maintenance of Malaysia passport personalisation (2011-2013), leading the team for Polycarbonate Datapage migration and maintenance of the personalisation system (2013-current), and deployment and maintenance of ICAO compliant chip system and border control for Malaysian citizen autogate system (2016-current). He does not hold any directorship in other public companies and listed companies. Head of Government Sector 1 / Chief Technical Officer ENCIK HASHIM BIN ABU MALE 57 YEARS OLD MALAYSIAN KEY SENIOR MANAGEMENT’S PROFILE

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